View TZA1048_288761.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

INTEGRATED CIRCUITS
DATA SHEET
TZA1048 4-channel BTL driver for CD/DVD drives
Product specification 2004 Mar 09
Philips Semiconductors
Product specification
4-channel BTL driver for CD/DVD drives
CONTENTS 1Features 2Applications 3General description 4Ordering information 5Block diagram 6Pinning 7Functional data 7.1General notes 8Limiting values 9Characteristics 10Test and application information 11Package outline
TZA1048
12Soldering 12.1Introduction to soldering surface mount packages 12.2Reflow soldering 12.3Wave soldering 12.4Manual soldering 12.5Suitability of surface mount IC packages for wave and reflow soldering methods 13Data sheet status 14Definitions 15Disclaimers
2004 Mar 09
2
Philips Semiconductors
Product specification
4-channel BTL driver for CD/DVD drives
1 FEATURES 2 APPLICATIONS
TZA1048
* Two Bridge-Tied Load (BTL) driver channels for sled and spindle motors and actuators * Pulse Width Modulation (PWM) input * Integral thermal shut-down circuit * Integral mute control * Two regulated reference voltage outputs for other chips in system; 3.3 V and 1.8 V respectively * HSOP28 package. 4 ORDERING INFORMATION
* BTL driver for CD and DVD players. 3 GENERAL DESCRIPTION
The TZA1048 is a four-channel BTL driver IC for driving motors and actuators in CD and DVD players. Two reference voltage outputs are also available for peripheral ICs such as servo and pick-up head drivers. The spindle motor control inputs to the IC can be either differential or single-ended.
PACKAGE TYPE NUMBER NAME TZA1048TH HSOP28 DESCRIPTION plastic, heatsink small outline package; 28 leads VERSION SOP007
2004 Mar 09
3
Philips Semiconductors
Product specification
4-channel BTL driver for CD/DVD drives
5 BLOCK DIAGRAM
TZA1048
VOUT3.3
28
3.3 V GENERATOR
1.8 V GENERATOR x1
1
VCC
VFBIN3.3
27
2
RADOUTN
VOUT1.8
26
x1
3
FOCOUTP
VFBIN1.8
25
4 x1 MUTE
24 k 32.3 k
GND
MUTE
24
5
FOCOUTN
RADIN
23
x1
6
RADOUTP
FOCIN
22 24 k
32.3 k
7
VCC
TZA1048
32.3 k
SLIN
21 24 k x1
8
VCC
VBIASIN
20
32.3 k
9
SLOUTP
x1
GND
19
10
SLOUTN
VBIASOUT
18 x0.5
32.3 k
11 12
GND
MOTBIAS
17
MOTOUTP
MOTIN1
16
24 k
x0.5
13
MOTOUTN
MOTIN2
15
24 k
14
VCC
mce470
Fig.1 Block diagram.
2004 Mar 09
4
Philips Semiconductors
Product specification
4-channel BTL driver for CD/DVD drives
6 PINNING SYMBOL VCC RADOUTN FOCOUTP GND FOCOUTN RADOUTP VCC VCC SLOUTP SLOUTN GND MOTOUTP MOTOUTN VCC MOTIN2 MOTIN1 MOTBIAS VBIASOUT GND VBIASIN SLIN FOCIN RADIN MUTE VFBIN1.8 VOUT1.8 VFBIN3.3 VOUT3.3 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 supply voltage radial coil driver negative output focus coil driver positive output ground focus coil driver negative output radial coil driver positive output supply voltage supply voltage sled motor driver positive output sled motor driver negative output ground spindle motor driver positive output spindle motor driver negative output supply voltage spindle motor driver input 2 spindle motor driver input 1 spindle motor bias input 1.65 V bias voltage output ground bias voltage input sled motor driver input focus coil driver input radial coil driver input mute control input DESCRIPTION
TZA1048
1.8 V generator/regulator feedback voltage input 1.8 V generator/regulator output 3.3 V generator/regulator feedback voltage input 3.3 V generator/regulator output
2004 Mar 09
5
Philips Semiconductors
Product specification
4-channel BTL driver for CD/DVD drives
7 7.1 FUNCTIONAL DESCRIPTION General notes
TZA1048
VCC RADOUTN FOCOUTP GND FOCOUTN RADOUTP VCC
1 2 3 4 5 6 7
28 VOUT3.3 27 VFBIN3.3 26 VOUT1.8 25 VFBIN1.8 24 MUTE 23 RADIN 22 FOCIN
1. The integral thermal shut-down circuit mutes the output current when the chip temperature reaches 175 C (typical). The hysteresis is set to 25 C (typical), so the circuit will restart when the chip temperature falls to 150 C (typical). 2. Mute mode is activated when the voltage at pin MUTE is below 0.5 V, and deactivated when the voltage at pin MUTE is above 1.2 V. In mute mode, both positive and negative output terminals will be at high-impedance state. However, the 3.3 V and 1.8 V outputs are not affected. 3. It is recommended that a 220 F decoupling capacitor is connected between pins VCC and pin GND and physically located as close as possible to these supply pins.
TZA1048TH
VCC SLOUTP
8 9
21 SLIN 20 VBIASIN 19 GND 18 VBIASOUT 17 MOTBIAS 16 MOTIN1 15 MOTIN2
mce471
SLOUTN 10 GND 11 MOTOUTP 12 MOTOUTN 13 VCC 14
4. The positive outputs of the focus, radial and sled driver channels are in phase with their respective input signals. The positive output of the spindle driver channel is in phase with the input signal on pin MOTIN1. 5. The values of the resistors connected to each input channel must be equal to, or larger than, 4.7 k to ensure that the gain of each input stage is less than, or equal to 1. 6. The GND pins are internally connected to heat dissipation fins within the package. You must ensure that these pins are connected to an external ground. 7. The 1.65 V bias voltage output from pin VBIASOUT is derived from the internal 3.3 V generator/regulator, and will be affected by any variation in the 3.3 V generator/regulator voltage.
Fig.2 Pin configuration.
2004 Mar 09
6
Philips Semiconductors
Product specification
4-channel BTL driver for CD/DVD drives
8 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VCC P Toper Tstg supply voltage power dissipation operating temperature storage temperature PARAMETER MIN. - - 0 -55
TZA1048
MAX. 13.5 1.7 70 +150
UNIT V W C C
9 CHARACTERISTICS Tamb = 25 C; VCC = 9 V; RL = 8 ; unless otherwise specified. SYMBOL B VCC PSRR Iq Istb VMUTE(L) VMUTE(H) bandwidth power supply power supply rejection ratio quiescent current standby current low level voltage on pin MUTE; mute mode active high level voltage on pin MUTE; mute mode inactive at VCC = 5 V unloaded mute mode active; unloaded PARAMETER CONDITIONS MIN. 20 6 30 - - 0 2 TYP. 25 9 38 20.3 2.1 - - MAX. 100 13 - 36 10 0.8 5 UNIT kHz V dB mA mA V V
Radial coil driver VOO(rad) Icon(rad) Ip(max)(rad) Grad output offset voltage maximum constant current maximum peak current gain RL = 8 RL = 8 VCC = 9 V; Vi = 700 mV (p-p); Rext = 4.7 k; note 1 - 250 250 6 20 300 430 7 50 - - 8 mV mA mA dB
Focus coil driver VOO(foc) Icon(foc) Ip(max)(foc) Gfoc output offset voltage maximum constant current maximum peak current gain RL = 8 RL = 8 VCC = 9 V; Vi = 700 mV (p-p); Rext = 4.7 k; note 1 - 250 370 6 20 300 430 7 50 - - 8 mV mA mA dB
Sled motor driver VOO(sle) Icon(sle) Ip(sle) Gsle output offset voltage maximum constant current maximum peak current gain RL = 8 RL = 8 VCC = 9 V; Vi = 700 mV (p-p); Rext = 4.7 k; note 1 - 200 370 6 20 300 430 7 50 - - 8 mV mA mA V/V
2004 Mar 09
7
Philips Semiconductors
Product specification
4-channel BTL driver for CD/DVD drives
TZA1048
SYMBOL Spindle motor driver VOO(spin) Icon(spin) Ip(spin) Gspin
PARAMETER
CONDITIONS
MIN. -
TYP. 10 430 600 1.12
MAX. 50 - - 1.26
UNIT
output offset voltage maximum constant current maximum peak current gain RL = 4 RL = 4 VCC = 9 V; Vi = 700 mV (p-p); Rext = 4.7 k; note 1
mV mA mA V/V
400 560 1
3.3 V generator Vfb(3.3) IO(3.3) Vfb(1.8) IO(1.8) Note 1. For gain measurements, only the channel being tested is active, the others are inactive; see Fig.4. feedback voltage output current 3.1 3 3.3 4.4 3.5 5 V mA
1.8 V generator feedback voltage output current 1.7 3 1.8 4.2 1.9 5 V mA
2004 Mar 09
8
Philips Semiconductors
Product specification
4-channel BTL driver for CD/DVD drives
10 TEST AND APPLICATION INFORMATION
TZA1048
handbook, halfpage
3
MCE472
P (W)
2
1
0 0 50 100 150 200 Tamb (C)
70 x 70 x 1.6 mm glass epoxy board. At temperatures above Tamb = 25 C, power dissipation is de-rated at 13.6 mW/C.
Fig.3 Power dissipation as a function of ambient temperature.
2004 Mar 09
9
Philips Semiconductors
Product specification
4-channel BTL driver for CD/DVD drives
TZA1048
Q1 VOUT3.3 28 3.3 V 47 F Q2 VOUT1.8 26 1.8 V 47 F VFBIN1.8 25 x1 4 GND 8 8 VFBIN3.3 27 3.3 V GENERATOR 1.8 V GENERATOR x1 1 VCC 12 V 220 F
2 RADOUTN
x1
3 FOCOUTP
MUTE 24
MUTE 24 k
32.3 k
5 FOCOUTN
4.7 k
RADIN 23
x1
6 RADOUTP
4.7 k
FOCIN 22 24 k
32.3 k
7
VCC
12 V
TZA1048
32.3 k 4.7 k SLIN 21 24 k x1 8 VCC 12 V
VBIASIN 20 32.3 k GND 19
9 SLOUTP 8 10 SLOUTN GND
x1
VBIASOUT 18 x0.5
11
MOTBIAS 17
32.3 k
12 MOTOUTP 8 13 MOTOUTN
MOTIN1 16 4.7 k Vs 4.7 k MOTIN2 15
24 k
x0.5
24 k 14
VCC
mce473
Fig.4 Gain test configuration.
2004 Mar 09
10
Philips Semiconductors
Product specification
4-channel BTL driver for CD/DVD drives
TZA1048
handbook, full pagewidth
12 V 220 F
1 2 3 radial coil focus coil 4 5 6 12 V 7
28 27 26 25 24 23 22
Q1 3.3 V 47 F Q2 1.8 V 47 F
TZA1048
12 V
8 9
21 20 19 18 17 16 15 SLED COIL FOCUS RADIAL COIL COIL
sled motor
M 10 11
12 V
12 spindle motor M 13 14
SERVO/COIL DRIVER SPINDLE MOTOR1 SPINDLE MOTOR2
M loading motor
FORWARD
MUTE
MICROCONTROLLER REVERSE
MCE474
Fig.5 Spindle motor differential control application.
2004 Mar 09
11
Philips Semiconductors
Product specification
4-channel BTL driver for CD/DVD drives
TZA1048
handbook, full pagewidth
12 V 220 F
1 2 3 radial coil focus coil 4 5 6 12 V 7
28 27 26 25 24 23 22
Q1 3.3 V 47 F Q2 1.8 V 47 F
TZA1048
12 V
8 9
21 20 19 18 17 16 15 SLED COIL FOCUS RADIAL COIL COIL
sled motor
M 10 11
12 V
12 spindle motor M 13 14
SERVO/COIL DRIVER SPINDLE MOTOR1
M loading motor
FORWARD
MUTE
MICROCONTROLLER REVERSE
MCE475
Fig.6 Spindle motor single-ended application.
2004 Mar 09
12
Philips Semiconductors
Product specification
4-channel BTL driver for CD/DVD drives
11 PACKAGE OUTLINE
HSOP28: plastic, heatsink small outline package; 28 leads
TZA1048
SOP007
D
E
c y HE X
28
15
A A2 A1
Lp 1 b e 14 detail X L
b1
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm Note 1. Plastic or metal protrusions are not included. OUTLINE VERSION SOP007 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION A max. 2.31 A1 0.20 0.05 A2 max 2.2 b 5.25 5.05 b1 0.45 0.30 c 0.30 0.23 D (1) 18.67 18.41 E (1) 7.75 7.49 e 0.8 HE 10.02 9.62 L 1.1 Lp 1.0 0.4 y 0.089
ISSUE DATE 03-07-28
2004 Mar 09
13
Philips Semiconductors
Product specification
4-channel BTL driver for CD/DVD drives
12 SOLDERING 12.1 Introduction to soldering surface mount packages
TZA1048
To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 12.4 Manual soldering
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 12.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 270 C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: * below 225 C (SnPb process) or below 245 C (Pb-free process) - for all BGA, HTSSON-T and SSOP-T packages - for packages with a thickness 2.5 mm - for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages. * below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. 12.3 Wave soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems.
2004 Mar 09
14
Philips Semiconductors
Product specification
4-channel BTL driver for CD/DVD drives
12.5 Suitability of surface mount IC packages for wave and reflow soldering methods PACKAGE(1) BGA, HTSSON..T(3), LBGA, LFBGA, SQFP, SSOP..T(3), TFBGA, USON, VFBGA DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC(5), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP CWQCCN..L(8), PMFP(9), WQCCN..L(8) Notes not suitable not suitable(4) suitable not not recommended(5)(6) recommended(7)
TZA1048
SOLDERING METHOD WAVE REFLOW(2) suitable suitable suitable suitable suitable not suitable
not suitable
1. For more detailed information on the BGA packages refer to the "(LF)BGA Application Note" (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 5. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. 9. Hot bar or manual soldering is suitable for PMFP packages.
2004 Mar 09
15
Philips Semiconductors
Product specification
4-channel BTL driver for CD/DVD drives
13 DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION
TZA1048
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data Qualification
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 14 DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 15 DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2004 Mar 09
16
Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2004
SCA76
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R04/01/pp17
Date of release: 2004
Mar 09
Document order number:
9397 750 11572

▲Up To Search▲

Price & Availability of TZA1048

	To Download TZA1048 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .